What production equipment does a silicon wafer manufacturer have?

The production equipment of silicon wafer manufacturers mainly includes the following types: Crystal growth equipment, single crystal furnace: It is the key equipment for producing single crystal silicon wafers. Through techniques such as the czozoic method (CZ method) or the magnetic field czozoic method (MCZ method), high-purity silicon materials are melted at high temperatures, and then slowly pulled by seed crystals to grow single crystal silicon rods. Common manufacturers include Jingsheng Electromechanical and Liancheng CNC, etc. Polycrystalline furnace: It is used for the production of polycrystalline silicon ingots. Polycrystalline silicon materials are put into the furnace, and through processes such as heating, melting and solidification, polycrystalline silicon ingots are formed. Silicon rod processing equipment cutting machine: Cut off the head, tail and parts exceeding the customer's specifications of the monocrystalline silicon rod, segment the monocrystalline silicon rod into lengths that can be processed by the slicing equipment, and at the same time cut test pieces to measure the resistivity and oxygen content of the monocrystalline silicon rod. Square cutting machine: Mainly used for grinding the four flat surfaces of polycrystalline silicon/monocrystalline silicon rectangular prisms. Reverse grinding machine: It is used to roll and grind the outer diameter of monocrystalline silicon rods to obtain a more precise diameter. Slicing equipment, diamond wire cutting machine: Currently, the main method for cutting silicon wafers is electroplated diamond wire. Through the high-speed moving diamond wire, the silicon rods are cut into thin slices. Gaoce Co., Ltd. and Yujing Technology are the major manufacturers in this field. Silicon wafer surface treatment equipment grinding machine: It mechanically grinds the silicon wafers after slicing to make the surface of the silicon wafers smoother and reduce the thickness deviation of the silicon wafers at the same time. Polishing machine: It adopts chemical mechanical polishing (CMP) technology to perform high-precision polishing on silicon wafers, achieving extremely high flatness and smoothness on the surface of silicon wafers, meeting the requirements of high-end application fields such as semiconductors. Chamfering machine: It grinds the right-angled edges of the silicon wafer into an arc shape, reducing the risk of cracking at the edges and also facilitating subsequent processes such as photolithography and epitaxial growth. Cleaning machine: Use deionized water and various chemical solvents to clean silicon wafers, removing dust adhering to the surface of silicon wafers during the manufacturing process.