The main factors in the silicon wafer cutting process

In the silicon wafer cutting process, the number of silicon wafers mainly depends on the following factors:

1) Cutting line diameter:

Thinner cutting lines mean lower notch loss, which means that the same silicon block can produce more silicon wafers. However, the cutting line is thinner and more prone to breakage.

2) Load:

The total area of each cut is equal to the area of the silicon wafer X the number of silicon blocks cut each time X the number of silicon wafers cut from each silicon block.

3) Cutting speed:

The speed at which the cutting table cuts the net through the cutting wire depends on the movement speed of the cutting wire, the power of the motor and the pulling force of the cutting wire.

4) Ease of maintenance:

The wire saw needs to replace the cutting wire and grinding slurry between cuts. The faster the maintenance speed, the higher the total productivity.

Tips for selecting silicon wafers for solar cells:

1. Appearance: It must be free of cracks, hard damages, holes and chipped edges.

2. Physical indicators: Physical indicators include crystal orientation, crystal orientation deviation, type, thickness, side length, and verticality. Determine the type, crystal direction, etc. with the corresponding testing instruments; Five points of thickness, tolerance, side length, diagonal length and tolerance, verticality, etc. of photovoltaic cells were randomly measured with corresponding measuring instruments. The most important thing is to check the thickness and thickness variation (TTV) of the silicon wafers. If the thickness is lower than the minimum production thickness, the fragmentation rate will increase. In addition, the carbon and oxygen content is of great significance to the quality of silicon wafers and must be randomly tested.

3. Electrical indicators: Mainly the minority carrier service life and resistivity of silicon wafers. The grade of silicon wafers is mainly determined by these two indicators. For instance, currently, the minority carrier lifetime requirement for A-level monocrystalline silicon wafers is greater than 10μs, and the resistivity is 0-6Ω.cm.