How to cut and slice solar silicon wafers

I. Production Grades of Solar Silicon Wafers

1. Grade A (the highest grade for solar silicon wafer production)

2. Grade A-1 (with minor defects);

3. Grade B (can be used with difficulty)

4. Grade C (can be zoned)

5. Grade D (no different from fragments).

Second, cut the surface of the solar silicon wafers according to their production grades

Silicon wafer cutting technology for solar photovoltaic cells is a key part of the manufacturing process of solar photovoltaic cells. This process is used to process solid silicon ingots of monocrystalline silicon or polycrystalline silicon. The photovoltaic module wire saw first cuts the silicon ingots into cubes, and then into very thin silicon wafers. Silicon wafers are the substrates for manufacturing photovoltaic cells.

Silicon blocks are fixed on the cutting table, usually four at a time. The cutting table passes through the moving cutting wire to cut the net, thus cutting the silicon blocks into silicon wafers. The wire saw must precisely balance and control the diameter of the cutting wire, the cutting speed and the total cutting area, so as to achieve a uniform silicon wafer thickness without breaking the silicon wafer and shorten the cutting time.